for the electronics industry. PIEK provides customized training programs worldwide for all those who have to deal with electronic modules and circuit boards: OEMs, production service providers for electronic components, subcontractors, rework and repair companies, PCB manufacturers & assembly operations, the automotive industry, armed forces, aviation businesses and others. PIEK, Global leader in training and consultancy for connecting electronics
Need to plan the training at another time, or can’t find the training you need in this overview? Read more information about our In-Company & Tailor-made training programs or contact our sales department, who will gladly answer your questions. Contact us!
From Monday 27 May 2013 until Friday 31 May 2013
Heerlen, The Netherlands
From Tuesday 28 May 2013 until Friday 31 May 2013
Heerlen, The Netherlands
From Tuesday 28 May 2013 until Friday 31 May 2013
Heerlen, The Netherlands
From Tuesday 28 May 2013 until Friday 31 May 2013
Heerlen, The Netherlands
From Tuesday 28 May 2013 until Friday 31 May 2013
Heerlen, The Netherlands
From Monday 03 June 2013 until Wednesday 05 June 2013
Heerlen, The Netherlands
From Tuesday 04 June 2013 until Thursday 06 June 2013
Heerlen, The Netherlands
From Thursday 06 June 2013 until Friday 07 June 2013
Heerlen, The Netherlands
4–5 June 2013 • Frankfurt, Germany • Hotel InterContinental Frankfurt Explore the latest developments in embedded component technology at the IPC/FED Conference on Embedded Components. Designed to bring the entire supply chain together, this confe...
The counterfeiting of electronic components continues to rise alarmingly. IHS iSuppli reported that, in the first eight months of 2012, more than 100 incidents of counterfeiting were reported each month. In the past six years, more than 12 million ...
The problem is that during April’s earnings call, CEO Tim Cook said Apple was hard at work on amazing new hardware and software, but that it was not coming until the fall and “throughout 2014.”
J-STD-001E Instructor or Specialist including Module 6 J-STD-001ES Space Addendum - Requirements for Soldered Electrical and Electronic Assemblies
IBM continues to expand its operations in key growth markets and we plan to lead the way by bringing Africa into our global network of IBM Research laboratories
J-STD-00ES Space provides additional requirements over those published in IPC JSTD-001E to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments experienced while tra...
National and international, group photographs, theory courses, practical training and this time even a van with a mention of an IPC certification.
Taiwan tech giant Hon Hai, parent company of FoxConn, will pay royalties to Microsoft to ward off a lawsuit over its production of devices using rival Google's Android and Chrome platforms
Ultra-miniaturized LEDs injected deep into the brain illuminate mysteries of neuroscience. The light triggers very targeted neurons, providing insight into structure, function, and complex connections within the brain.
Philips creates the world’s most energy-efficient warm white LED lamp. First LED lamp prototype delivering 200 lumen per watt high quality light, halving the energy use compared to current LED lamps.
The same material that formed the first primitive transistors more than 60 years ago can be modified in a new way to advance future electronics, according to a new study. Chemists at The Ohio State University have developed the technology for maki...
IPC — Association Connecting Electronics Industries® announced the French language release of IPC-7711/21B, Reprise, Modification et Réparation des Assemblages Electroniques. The new B revision involved a complete review and update of every rework an...
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Posted by: PIEK International Education Centre (I.E.C.)
Liquipel™ founded in 2011 by Danny McPhail and Kevin Bacon who are determined to protect devices around the world from water damage. Liquipel is not a case, but a nano-sized coating that protects the device's circuitry in the event of accidental wate...
As promised, we want to share the results of our customer satisfaction survey with you. PIEK is very proud to see how many of our customers took the time and trouble to give us feedback on our services. This shows us how very interested our custome...
BANNOCKBURN, Ill., USA, February 26, 2013 — IPC — Association Connecting Electronics Industries® bestowed its highest corporate honors to Lockheed Martin and Intel Corporation. During a luncheon held in conjunction with IPC APEX EXPO®, IPC awarded ...
NEW! Includes greatly expanded criteria for molding, potting, splicing, crimp contacts without insulation support, inline insulation displacement connectors, connectorization, rigid and conformable cable, flexible sleeving, broomstitching, testing,...
Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated through holes.
New type of microchip created which not only moves information from left to right and back to front, but up and down as well. Scientists from the University of Cambridge have created, for the first time, a new type of microchip which allows inform...
BANNOCKBURN, Ill., USA, January 30, 2013 — Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the ne...
BANNOCKBURN, Ill., USA, January 15, 2013 — As chip sizes shrink and system features and functions expand, board designers are increasingly challenged with recalling all the parameters and guidelines they need for every aspect of board layout. The new...
Here is the image I promised +PIEK International Education Centre (I.E.C.) and +Wilco Wings in http://goo.gl/3KPpz to send you when I won the Nexus 7 in your give away http://goo.gl/OESSu #selfportrait #gadget #gadgetlove #nexus7 Written ...
Nick Cayler from Bosten won a Nexus 7 with a PIEK International Education Centre (I.E.C.) contest. Nick drew a homage to the PIEK logo, wrote a nice piece of text, that is why we chosen him as the winner of the Nexus 7. Visit the following link for...
In the weeks before Christmas, we try to keep training classes closer to home, usually this works out, all training classes take place across Europe. This way we keep the trainers closer to home, they are closer to their families for the start of t...
Apologies for the delay in the announcement of the winner. The draw came up a winner who unfortunately did not meet the requirements. Therefore the price moves now to the 2nd on the list. We congratulate Beatrice Karjalainen from Sweden! The Nexus...
How to qualify?: share public & +1 & follow us on Google Plus We also like to welcome you on our new community! Prize for Nexus 7 Giveaway | 7 JAN 2013: 1 Nexus 7 32GB incl shipping with +FedEx Terms and Conditions: -Contest Nexus 7 ...
Congratulations +Erik Rijsdam!
Foxconn International Holdings Ltd., an affiliate of Hon Hai Group, has allegedly manufactured a new smartphone model for Amazon on an exclusive basis, according to industry sources. Some smartphone parts makers involved in the supply of Amazon’s...
Arnav Kalra living in Karnal, Haryana, India won one of our Nexus 7 devices we had to give away in a random pick. https://plus.google.com/112107145123351418554/posts/ZQMfMG8xFRj
Taiwan-based Macronix has found a solution for a weakness in flash memory fadeout. A limitation of flash memory is simply that eventually it cannot be used; the more cells in the memory chips are erased, the less useful to store data. The write-erase...
How to qualify: Share this post Public & Follow the +PIEK International Education Centre (I.E.C.) page! The rules in relation to the previous giveaway are slightly changed: Prize for Nexus 7 Giveaway | 7 DEC 2012: 1 Nexus 7 32GB incl shippin...
And the winner is... +Arnav Kalra Congratulations +Arnav Kalra The Nexus is coming your way a.s.a.p! It would be great if you post some pictures with your new #Nexus7! Next GiveAway starts later today
The Exynos 5 Dual is the first ARM technology-based SoC to bring both high performance and energy efficiency to Chromebooks a world leader in advanced semiconductor solutions, announced that its Exynos 5 Dual application processor powers the new Go...
Heerlen, The Netherlands, November 19-23 - During several training programs (IPC-WHMA-A-620, IPC PCB Designer Certification CID & Wave and Reflow Soldering) PIEK International Education Centre (I.E.C.) gave away a Nexus 7 to every participant. Fo...
TFT technology, which found its way long ago out of just the high-end vehicle segment, is becoming an increasingly worthwhile technology for motorcycle manufacturers, as this kind of display unit offers motorcyclists virtually unlimited possibiliti...
A unique robot with unique features Baxter is an entirely new type robot that is redefining the way robots can be used in manufacturing environments. It performs a variety of repetitive production tasks – all while safely and intelligently working...
Samsung May Start Mass Producing Bendable Smartphones Next Year In a bid to differentiate itself from the rivals, Samsung Electronics, one of the world’s largest consumer electronics conglomerates, may start mass production of bendable smartphones...
The automotive industry has long lagged behind the consumer electronics market. Naturally, this presents an opportunity for Google to step in and innovate. The pace of consumer electronic innovation has created a discontinuity in the automobile in...
Flexible photovoltaics made of carbon promise low cost and durability, if their performance can be improved. Using a grab bag of novel nanomaterials, researchers at Stanford University have built the first all-carbon solar cells. Their carbon phot...
Stuttgart, Germany, November 7 - During an IPC-A-600H CIT & CIS training, we have raffled a Nexus 7. It was very exciting for the training participants, all names on a piece of paper in a basket, and the hostess of the site had the honor to draw ...
Foxconn, the principle electronics assembly company for the iPhone 5, may be having huge difficulties in producing enough iPhone 5s due to the complexity of the unit and...
NEW! Includes greatly expanded criteria for molding, potting, splicing, crimp contacts without insulation support, inline insulation displacement connectors, connectorization, rigid and conformable cable, flexible sleeving, boomstitching, testing, an...
What do you get when you combine a pumpkin with the classic video game Tetris? Pumpktris! Fully playable, embedded in a pumpkin, and with the stem serving as a controller. Watch the video to see it in action, then read on for the development story....
2H'Apr. NAND Flash contract prices have weakened due to the tepid demand in the off-peak season....
Freescale Semiconductor has added advanced floating point technology to its QorIQ Qonverge B4 product family....
ZMD AG (ZMDI), a Dresden-based semiconductor company, has extended its IPv6 modules portfolio with a size and cost optimized version of the ZWIR4512.....
Broadcom introduced its first 5G WiFi combination chips targeted specifically for entry level consumer devices, including PCs, notebooks, tablets and ...
Cadence Design Systems has completed the acquisition of Cosmic Circuits Private Limited, a provider of analog and mixed signal intellectual property (...
Infineon Technologies AG is supplying security chips to Taiwan’s electronic passport program....
The headlines often trumpet news about declining commodity prices. So why don’t these reductions ever seem to result in price reductions from supplier...
STMicroelectronics announced today that, effective immediately, ST Executive Vice President Jean-Marc Chery has been appointed General Manager of the ...
Swedish Optronic, working with optical sensoring solutions, caught the attention of Björn Åstrand, assistant professor at Halmstad University, and man...
A slowdown in notebook and desktop personal computer purchases coupled with strong growth in smartphones and tablet PCs knocked AMD down to fourth pla...
No, we did not see the unveiling of an Xbox 720, nor a “Durango” – what we got was the Xbox One. But, is it at all what we expected?...
Crocus Technology and TowerJazz signed a licensing and joint promotion agreement for the use of Crocus’ Magnetic Logic Unit (MLU) process technology b...
Mentor Graphics has teamed with OpSIS Foundries and Lumerical Solutions to develop a complete EDA-style, full flow process design kit (PDK) for the Op...
STMicroelectronics Executive Vice President Jean-Marc Chery has been appointed General Manager of the Embedded Processing Solutions Segment, a new pos...
Driven by falling prices and a major initiative from Intel, shipments of touch-enabled mobile PCs are expected to enjoy rapid growth in 2013 and the c...
In a small field of top tier competitors, the overall EPC top spot goes to Ericsson, mostly due to its high Implementation scores, next we find Huawei...
Retail prices for LED bulbs worldwide continue to have a downward trend this year for April....
Renesas Electronics Europe teamed up with the software alliance partner HCC Embedded, to offer an innovative software support programme for European c...
TV panel makers are betting on a high rate of growth for UHD LCD TVs during the next four years. These companies expect to ship nearly 943,000 UHD LCD...
EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European a...
Logic Supply released the LGX AU970 Intel Core Fanless Computer, designed for demanding industrial applications like high-end automation, data collect...
Chipmaker Intel's new CEO, Brian Krzanich, have made some big changes in a very short time – one of them, the creation of a new unit aimed at growing ...
1H'May NAND Flash contract prices are gradually declining due to the persistent effects of the off-peak season....
Toshiba has developed second generation 19 nanometre process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory...
Shanghai ISSON Power Quality Co., Ltd. installed 126 of Maxwell's 125V Heavy Transportation Modules in a power system that operates 26 ship-to-shore c...
The solar photovoltaic (PV) market is poised to rise from the ashes of its 2011 crisis to grow to $155 billion in 2018, as market forces engineer a tu...
Kyocera Corporation's subsidiary, Kyocera SLC Technologies Corporation (KST), expands is operations in Japan with a second manufacturing facility at i...
Led by STMicroelectronics, Places2Be aims to support the deployment of a FD-SOI pilot line at 28nm and the subsequent node, as well as a dual source t...
Imec and Globalfoundries announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive ...
Galaxy Technologies Corporation have continued their growth strategy of investing in equipment and technology to support the increasing requirements o...
Toshiba Corporation has developed its second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gig...
Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, and Toshiba Corporation have extended their strategic technology c...
BANNOCKBURN, Ill., USA, May 20, 2013 — IPC — Association Connecting Electronics Industries ® has teamed up with PCB Libraries, Inc. to provide...
The semiconductor market is moving - when it comes to delivery times and component prices - only marginally....
Murata Manufacturing Co., Ltd. has commercialized the new low profile monolithic ceramic capacitor, 0603 size (1.6x0.8mm) with maximum chip thickness ...
International Rectifier has qualified and shipped product built on its Gallium Nitride (GaN)-based power device technology platform for a home theater...
Renesas Electronics Europehas teamed up with its software alliance partner port GmbH to offer a software support programme to European customers....
At least 5 M&A cases occurred in China and Taiwan; Epistar, for example, acquired 49% of Huga’s equity, and Sanan Opto acquired 120 million of FOR...
Molex Incorporated announces a further extension of its CMC product line with the introduction of a 28-circuit right-angle header....
The new report from IDTechEx finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023....
BANNOCKBURN, Ill., USA, May 16, 2013 — IPC — Association Connecting Electronics Industries ® and the Surface Mount Technology Association anno...
Total 4Q12 revenue for the mobile DRAM industry grew 21.4% from the third quarter and reached US$2.74 billion, boosted by climbing shipments of low to...
Swiss-based u-blox is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market....
Flir Systems has received an order to support the U.S. Coast Guard valued at USD 23 million....
CEA-Leti announced Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently com...
Maxim Integrated Products is now shipping the MAX11156, the industry’s smallest 12-pin, 18-bit successive approximation register (SAR) analog-to-digit...
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accele...
Fingerprint Cards (FPC) receives additional mass production order of 455'000 units for its swipe sensor technology for the Asian smartphone market for...
Data Respons has entered into a contract with a Swedish technology group for delivery of specialised services. The contract has a preliminary scope of...
FTDI Chip, has expanded its distribution agreement with Arrow Electronics, Inc. in order to gain greater supply chain traction in Japan....
BANNOCKBURN, Ill., USA, May 16, 2013 — Electronics industry professionals have a new venue for collaboration on IPC standards, with opportunitie...
Omron Electronic Components announces that it has appointed Eastern Europe catalogue supplier TME as franchised distributor for Poland, the Czech Repu...
The high-flying acceleration and yaw sensor product category was brought back to earth in 2012 when price erosion pulled down annual sales growth to 7...
BANNOCKBURN, Ill., USA, May 15, 2012 — IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2011 is ...
Product Toshiba Electronics Europe (TEE) has expanded its family of low-voltage, ultra-efficient MOSFETs with two new series that deliver the lowest O...
First Source Inc have signed a distribution agreement to sell IQD’s full range of frequency products throughout the USA....
BANNOCKBURN, Ill., USA, May 14, 2013 — The Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST), an independent organiz...
The global large-sized panel shipment in April 2013 was 65.2 million units, dropping 5% MoM. Dragged down by China’s weakening procurement for the May...
The Tokyo High Court has issued an order dismissing creditor appeals of the Tokyo District Court's approval of Elpida Memory, Inc.'s reorganization pl...
The use of Wi-Fi functionality in small-cell base stations will be a game changer for cellphone service providers, easing heavily congested data pipes...
BANNOCKBURN, Ill., USA, January 4, 2012 — To support the consistent and rapid growth in Eastern Europe’s electronics assembly indus...
BANNOCKBURN, Ill., USA, January 6, 2012 — As EMS companies have ramped up speeds to meet the high demand for electronics, equipment...
BANNOCKBURN, Ill., USA, February 16, 2012 — What will have the greatest impact on the electronics industry in five years? Will it b...
BANNOCKBURN, Ill., USA, January 6, 2012 — IPC – Association Connecting Electronics Industries ® ended the year 2011 with 3,215 me...
BANNOCKBURN, Ill., USA, January 9, 2012 — IPC — Association Connecting Electronics Industries ® is pleased to announce the winning...
BANNOCKBURN, Ill., USA, January 10, 2012 — Following two years in development, a draft of the industry’s first standard on the asse...
BANNOCKBURN, Ill., USA, January 11, 2012 — IPC has filed comments with the U.S. Department of State’s Directorate of Defense Trade ...
BANNOCKBURN, Ill., USA, January 11, 2012 — Before the action begins at IPC APEX EXPO 2012 , executives will gather for the IPC EM...
BANNOCKBURN, Ill., USA, January 18, 2012 — To assist the industry in understanding the conflict minerals legislation set forth in ...
BANNOCKBURN, Ill., USA, January 20, 2012 — More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Def...
Product The AMD Radeon HD 8970M graphics processing unit (GPU), powered by AMD’s Graphics Core Next (GCN) architecture. "Today’s gaming notebooks need...
BANNOCKBURN, Ill., USA, January 23, 2012 — With the proliferation of regulations focused on materials in products, IPC is expanding...
BANNOCKBURN, Ill., USA, January 26, 2012 — Representing advances in more than 100 product categories within the electronics manufa...
BANNOCKBURN, Ill., USA, January 30, 2012 — IPC’s recently published biennial wage and salary survey for the EMS industry shows a ca...
BANNOCKBURN, Ill., USA, January 31, 2012 — IPC — Association Connecting Electronics Industries ® announced today the December findings from its...
BANNOCKBURN, Ill., USA, February 1, 2012 — A key enabling technology that is making a significant impact in consumer, commercial, ...
BANNOCKBURN, Ill., and ARLINGTON, Va., USA, February 6, 2012 — IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Ha...
BANNOCKBURN, Ill., USA, February 8, 2012 — Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO ® a...
BANNOCKBURN, Ill., USA, February 10, 2012 — Representing IPC — Association Connecting Electronics Industries ® , Mikel Williams, pre...
BANNOCKBURN, Ill., USA, May 14, 2012 — IPC Midwest Conference & Exhibition will be held August 22–23, 2012, at the Renaissance Schaumburg C...
BANNOCKBURN, Ill., USA, May 10, 2012 — Steve Pudles, Chairman of the Board of IPC — Association Connecting Electronics Industries ® , today t...
BANNOCKBURN, Ill., USA, May 3, 2012 — IPC – Association Connecting Electronics Industries ® launched a survey today to measure the impact of...
BANNOCKBURN, Ill., USA, April 27, 2012 — IPC — Association Connecting Electronics Industries ® announced today the March findings from its mont...
BANNOCKBURN, Ill., USA, October 17, 2012 — IPC — IPC — Association Connecting Electronics Industries ® in partnership with Surface Mount Technol...
BANNOCKBURN, Ill., USA, October 16, 2012 — To support the rapidly growing electronics assembly market in Eastern Europe, IPC — Association Conn...
BANNOCKBURN, Ill., USA, October 16, 2012 — The Surface Mount Technology Association of Edina, Minn., and IPC — Association Connecting Electroni...
BANNOCKBURN, Ill., USA, October 15, 2012 — Following economic setbacks in 2009, the world market for electronics manufacturing services (EMS) co...
BANNOCKBURN, Ill., USA, October 11, 2012 — The July 2014 deadline for medical devices to be RoHS-compliant in Europe is a wake-up call for all ...
BANNOCKBURN, Ill., USA, October 10, 2012 — B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Lab...
BANNOCKBURN, Ill., USA, October 5, 2012 — IPC — Association Connecting Electronics Industries ® announces that Jasbir Bath of Bath and Associ...
BANNOCKBURN, Ill., USA, October 5, 2012 — Worldwide production of printed circuit boards (PCBs) experienced real growth of just 2.4 percent in 2...
BANNOCKBURN, Ill., USA, October 4, 2012 — IPC — Association Connecting Electronics Industries ® will host a new event in India focused on exp...
BANNOCKBURN, Ill., USA, October 1, 2012 — IPC — Association Connecting Electronics Industries ® announces that effective today, Raymond Foo h...
BANNOCKBURN, Ill., USA, September 28, 2012 — IPC — Association Connecting Electronics Industries ® announced today the August findings from its ...
BANNOCKBURN, Ill., USA, September 26, 2012 — To keep the momentum of the dramatic revolution in technology and functionality of today’s electron...
BANNOCKBURN, Ill., USA, September 24, 2012 — To help electronics manufacturers understand recent changes and trends in environmental regulatio...
BANNOCKBURN, Ill., USA, September 17, 2012 — To help the electronics manufacturing industry comply with the U.S. Securities and Exchange Commis...
BANNOCKBURN, Ill., USA, September 11, 2012 — Wading through the U.S. Securities and Exchange Commission’s (SEC) 356-page final conflict mineral...
BANNOCKBURN, Ill., USA, September 10, 2012 — Not your average hole in the board, high density interconnect (HDI) technology allows PCB manufact...
BANNOCKBURN, Ill., USA, August 29, 2012 — The Northeast is about to get a whole lot hotter as competitors fire up their soldering irons at the ...
BANNOCKBURN, Ill., USA, August 29, 2012 — Sixteen competitors showed off their hand soldering skills during an action-packed competition at IPC...
BANNOCKBURN, Ill., USA, August 29, 2012 — Year-on-year sales growth across the global electronics supply chain was mixed in the second quarter o...
BANNOCKBURN, Ill., USA, August 28, 2012 — IPC — Association Connecting Electronics Industries ® announced today the July findings from its month...
BANNOCKBURN, Ill., USA, August 27, 2012 — Theoretical physicist, best-selling author and futurist Dr. Michio Kaku has been selected through a v...
BANNOCKBURN, Ill., USA, August 23, 2012 — Joining the illustrious ranks of only three other companies, MacDermid, Inc. and Northrop Grumman are ...
BANNOCKBURN, Ill., USA, August 22, 2012 — Following years of advocacy, IPC and its members are relieved that the conflict minerals rule approv...
BANNOCKBURN, Ill., USA, August 22, 2012 — IPC – Association Connecting Electronics Industries ® presented Special Recognition, Distinguished ...
BANNOCKBURN, Ill., USA, August 22, 2012 — IPC — Association Connecting Electronics Industries ® invites researchers, technical experts and ind...
BANNOCKBURN, Ill., USA, August 15, 2012 — Electronics manufacturing operations with a total value of at least $2.5 billion are expected to be b...
BANNOCKBURN, Ill., USA, August 10, 2012 — North American printed circuit board (PCB) production declined considerably in 2011, but growth has ...
BANNOCKBURN, Ill., USA, August 9, 2012 — IPC – Association Connecting Electronics Industries ® has released IPC-HDBK-850, Guidelines for Desig...
BANNOCKBURN, Ill., USA, August 8, 2012 — The first IPC standard that originated outside the U.S., IPC-7527, Requirements for Solder Paste Printi...
BANNOCKBURN, Ill., USA, August 7, 2012 — Bragging rights are on the line as the Second Annual IPC Midwest Soldering Competition takes place, Au...
BANNOCKBURN, Ill., USA, August 3, 2012 — On August 22, IPC and the Chicagoland Circuit Board Association (CCBA) will host a meeting at IPC Mid...
BANNOCKBURN, Ill., USA, July 31, 2012 — IPC — Association Connecting Electronics Industries ® announced the German language release of IPC-77...
BANNOCKBURN, Ill., USA, July 26, 2012 — IPC — Association Connecting Electronics Industries ® announced today the June findings from its monthl...
BANNOCKBURN, Ill., USA, July 19, 2012 — On July 25, IPC will launch its new educational campaign, Follow the Law, Protect the Board, to raise ...
BANNOCKBURN, Ill., USA, July 17, 2012 — In a joint effort, IPC— Association Connecting Electronics Industries ® and JPCA (Japan Electronics P...
BANNOCKBURN, Ill., USA, July 12, 2012 — IPC — Association Connecting Electronics Industries ® has released IPC-1758, Declaration Requirements ...
BANNOCKBURN, Ill., USA, July 11, 2012 — As electronics manufacturers strive to keep costs of high density electronics in check, the potential o...
BANNOCKBURN, Ill., USA, July 9, 2012 — IPC — Association Connecting Electronics Industries ® announced the German language release of IPC-2222...
BANNOCKBURN, Ill., USA, July 3, 2012 — IPC — Association Connecting Electronics Industries ® invites experts to submit abstracts for the IPC Sy...
BANNOCKBURN, Ill., USA, July 2, 2012 — With more than 50 exhibitors and three-quarters of its show floor sold to date, IPC Midwest is geared up...
BANNOCKBURN, Ill., USA, June 29, 2012 — Electronic product and manufacturing trends continue to challenge both users and providers of test and ...
BANNOCKBURN, Ill., USA, June 27, 2012 — IPC — Association Connecting Electronics Industries ® announced today the May findings from its monthly...
BANNOCKBURN, Ill., USA, June 22, 2012 — IPC – Association Connecting Electronics Industries ® announces that IPC APEX EXPO ® has been named o...
BANNOCKBURN, Ill., USA, June 19, 2012 — IPC — Association Connecting Electronics Industries ® announces that Edward Trackman has joined the IPC...
BANNOCKBURN, Ill., USA, June 15, 2012 — PCB Technology Trends 2011 , a new study published in April by IPC — Association Connecting Electronics...
BANNOCKBURN, Ill., USA, June 14, 2012 — “Electronics in the Fast Lane: How High Speed Technologies are Changing the Game,” will be the theme of...
BANNOCKBURN, Ill., USA, June 12, 2012 — On Tuesday, June 5, 2012, leaders of IPC’s Environment, Health and Safety (EHS) Committee met with seni...
BANNOCKBURN, Ill., USA, June 11, 2012 — Just as IPC standards are balloted by industry, the decision of who will be the 2013 IPC APEX EXPO Ope...
BANNOCKBURN, Ill., USA, June 8, 2012 — To help designers and board assemblers address the challenges of working with new materials and smaller,...
BANNOCKBURN, Ill., USA, June 6, 2012 — At the invitation of U.S. House Oversight and Government Reform Committee Chairman Darrell Issa (R-CA), ...
BANNOCKBURN, Ill., USA, June 5, 2012 — If a picture is worth a thousand words, the H revision of IPC-A-600, Acceptability of Printed Boards , ...
BANNOCKBURN, Ill., USA, June 1, 2012 — As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex ch...
BANNOCKBURN, Ill., USA, May 30, 2012 — Over two days in August, the technical conference at IPC Midwest Conference & Exhibition ™ will high...
BANNOCKBURN, Ill., USA, May 25, 2012 — IPC — Association Connecting Electronics Industries ® announced today the April findings from its monthly...
BANNOCKBURN, Ill., USA, May 23, 2012 — Put a fair amount of stress on the bond between printed boards and electronic components and there’s a c...
BANNOCKBURN, Ill., USA, May 18, 2012 — Who will add his or her name to the hand soldering victor’s list of Nichole DeVries, Adam Conaway, Linnea...
BANNOCKBURN, Ill., USA, May 3, 2012 — As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applica...
BANNOCKBURN, Ill., USA, April 30, 2012 — New IPC President and CEO John Mitchell started his first week on the job at the association that, 55...
BANNOCKBURN, Ill., USA, April 30, 2012 — The job of testing or demonstrating materials and process compatibility just became easier with the n...
BANNOCKBURN, Ill., USA, April 26, 2012 — Following showers of praise at IPC APEX EXPO ® 2012, the number of exhibitor contracts for the 2013 ...
BANNOCKBURN, Ill., USA, April 24, 2012 — PCB Technology Trends 2011 , a new study published this week by IPC — Association Connecting Electr...
BANNOCKBURN, Ill., USA, April 11, 2012 — Flexible circuit technology is utilized in all market sectors, including military, telecommunications...
BANNOCKBURN, Ill., USA, April 6, 2012 — When a component manufacturer discontinues a particular component, it creates a ripple effect throughou...
BANNOCKBURN, Ill., USA, April 4, 2012 — IPC ’s second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held i...
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® invites researchers, academics, technical exper...
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E ...
BANNOCKBURN, Ill., USA, March 30, 2012 — IPC — Association Connecting Electronics Industries ® announced today the February findings from its m...
BANNOCKBURN, Ill., USA, March 29, 2012 — Providing convenient and cost-effective staff development, IPC — Association Connecting El...
BANNOCKBURN, Ill., USA, March 28, 2012 — IPC – Association Connecting Electronics Industries ® announces the appointment of John W...
BANNOCKBURN, Ill., USA, March 27, 2012 — The industry standard that establishes the specific requirements for the design of flexibl...
BANNOCKBURN, Ill., USA, March 26, 2012 — Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of ...
BANNOCKBURN, Ill., USA, March 22, 2012 — The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnection...
BANNOCKBURN, Ill., USA, March 19, 2012 — For many designers and manufacturing personnel in the electronics manufacturing supply cha...
BANNOCKBURN, Ill., USA, March 9, 2012 — IPC —Association Connecting Electronics Industries ® has issued a Call for Participation f...
BANNOCKBURN, Ill., USA, March 8, 2012 — Although global economic growth and electronics industry growth slowed in the fourth quarte...
BANNOCKBURN, Ill., USA, March 6, 2012 — The electronic interconnect industry came together at IPC APEX EXPO ® last week in San Dieg...
BANNOCKBURN, Ill., USA, March 1, 2012 — IPC – Association Connecting Electronics Industries ® announces the election of Douglas Pau...
BANNOCKBURN, Ill., USA, February 29, 2012 — IPC – Association Connecting Electronics Industries ® bestowed its highest corporate h...
BANNOCKBURN, Ill., USA, February 29, 2012 — The Nominating and Governance Committee of the IPC Board of Directors presented nine ca...
BANNOCKBURN, Ill., USA, February 28, 2012 — Since the “wild west” days of a relatively young printed circuit board industry when ru...
BANNOCKBURN, Ill., USA, February 28, 2012 — IPC – Association Connecting Electronics Industries ® presented Presidents, Special Reco...
BANNOCKBURN, Ill., USA, February 27, 2012 — IPC — Association Connecting Electronics Industries ® announced today the January findings from its ...
BANNOCKBURN, Ill., USA, February 22, 2012 — IPC – Association Connecting Electronics Industries ® has announced the winners of th...
BANNOCKBURN, Ill., USA, October 18, 2012 — IPC — Implementing lean concepts in electronics manufacturing is the focus of “IPC Symposium on Lean ...
BANNOCKBURN, Ill., USA, October 24, 2012 — Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, ...
BANNOCKBURN, Ill., USA, October 30, 2012 — The heat will be on as skilled competitors go soldering iron to soldering iron at the second annual I...
Imec and Renesas Electronics have entered into a new strategic research collaboration at Holst Centre....
BANNOCKBURN, Ill., USA, October 31, 2012 — IPC — Association Connecting Electronics Industries ® announced today the September findings from its...
BANNOCKBURN, Ill., USA, October 31, 2012 — Significant technical updates, greater ease-of-use and compatibility with other key assembly standard...
BANNOCKBURN, Ill., USA, November 5, 2012 — IPC — Association Connecting Electronics Industries ® announces that Sanjay Huprikar has joined the ...
BANNOCKBURN, Ill., USA, November 7, 2012 — With expertise on the latest design technologies, techniques and roadmapping efforts, the IPC Design...
Cambridge Nanotherm is to build its first prototype manufacturing plant in Haverhill, UK, following the award of GBP 250'000 in matched funding from t...
BANNOCKBURN, Ill., USA, November 9, 2012 — IPC — Association Connecting Electronics Industries ® announced the Chinese language release of IPC...
BANNOCKBURN, Ill., USA, November 12, 2012 — IPC — Association Connecting Electronics Industries ® announces the release of a Chinese-language ...
BANNOCKBURN, Ill., USA, November 12, 2012 — Comprehensive updates on pressing industry concerns, challenges and developments will be addressed ...
BANNOCKBURN, Ill., USA, November 13, 2012 — IPC — Association Connecting Electronics Industries ® has released the Dutch language E revision o...
BANNOCKBURN, Ill., USA, November 15, 2012 — Former corporate vice president of research and development (R&D) and strategic planning at Gen...
BANNOCKBURN, Ill., USA, November 20, 2012 — Before the activities at IPC APEX EXPO® get into full swing, industry executives will gather for...
BANNOCKBURN, Ill., USA, November 26, 2012 — As India strives to increase its share of the global electronic manufacturing market, companies th...
BANNOCKBURN, Ill., USA, November 27, 2012 — IPC — Association Connecting Electronics Industries ® announces the appointment of Philip S. Carm...
BANNOCKBURN, Ill., USA, November 29, 2012 — The explicit listing of printed boards in the U.S. State Department’s proposed revisions to the Ca...
BANNOCKBURN, Ill., USA, November 30, 2012 — IPC — Association Connecting Electronics Industries ® announced today the October findings from its ...
BANNOCKBURN, Ill., USA, December 3, 2012 — Need to address cleaning process issues or process defect dilemmas? Help is just a show floor away ...
BANNOCKBURN, Ill., USA, December 12, 2012 — Companies now have a new tool to address the intricacies and unique needs of the EMS contracting pr...
BANNOCKBURN, Ill., USA, December 12, 2012 — IPC today hosted an educational workshop for the country’s leading defense contractors on Internat...
BANNOCKBURN, Ill., USA, December 13, 2012 — Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO ® ...
BANNOCKBURN, Ill., USA, December 13, 2012 — The first IPC standard that originated outside the U.S., IPC-7527, Krav til Tinpastatryk , is also t...
BANNOCKBURN, Ill., USA, December 17, 2012 — IPC — Association Connecting Electronics Industries ® announces registration is now open for the I...
BANNOCKBURN, Ill., USA, December 21, 2012 — IPC — Association Connecting Electronics Industries® announced today the November findings from it...
BANNOCKBURN, Ill., USA, January 3, 2013 — Tackling the hot topics that have the electronics industry buzzing, seven free BUZZ sessions will be ...
BANNOCKBURN, Ill., USA, January 9, 2013 — To help industry professionals navigate conflict minerals compliance, IPC — Association Connecting El...
BANNOCKBURN, Ill., USA, January 14, 2013 — IPC — Association Connecting Electronics Industries ® introduces a new market research subscription...
BANNOCKBURN, Ill., USA, January 15, 2013 — As chip sizes shrink and system features and functions expand, board designers are increasingly chal...
BANNOCKBURN, Ill., USA, January 17, 2013 — One of the “cleanest” areas on the IPC APEX EXPO ® show floor will be found at the IPC/NPL Cleaning...
BANNOCKBURN, Ill., USA, January 22, 2013 — Conflict minerals compliance is expected to be more burdensome than the RoHS Directive. To help ensu...
BANNOCKBURN, Ill., USA, January 25, 2013 — New opportunities and answers to industry challenges will abound as leaders in the electronics manuf...
BANNOCKBURN, Ill., USA, January 28, 2013 — Known for providing a wealth of networking opportunities, IPC APEX EXPO ® is again offering numerou...
BANNOCKBURN, Ill., USA, January 29, 2013 — In regulatory comments filed yesterday, IPC commended the U.S. State Department for enumerating pr...
BANNOCKBURN, Ill., USA, January 30, 2013 — Design, assembly, inspection and repair personnel have a new tool to help improve reliability of bal...
BANNOCKBURN, Ill., USA, January 31, 2013 — IPC — Association Connecting Electronics Industries ® announced today the December findings from its ...
BANNOCKBURN, Ill., USA, February 4, 2013 — IPC APEX EXPO ® registrants can get a head start on planning which exhibitors to see and chart thei...
BANNOCKBURN, Ill., USA, February 4, 2013 — Hand soldering competitions will heat up the IPC APEX EXPO ® show floor as competitors strive to bu...
BANNOCKBURN, Ill., USA, February 6, 2013 — Latin America is showing a new resilience and faster economic growth, which may make it an attractiv...
BANNOCKBURN, Ill., USA, February 8, 2013 — IPC — Association Connecting Electronics Industries ® launched a new series of monthly market rese...
BANNOCKBURN, Ill., USA, February 12, 2013 — Hundreds of experts from around the world will discuss electronics manufacturing standards in more ...
BANNOCKBURN, Ill., USA, February 12, 2013 — To help companies develop an effective conflict minerals program to meet customer, legal and regula...
BANNOCKBURN, Ill., USA, February 14, 2013 — IPC – Association Connecting Electronics Industries ® has announced the winners of the Best U.S. a...
BANNOCKBURN, Ill., USA, February 19, 2013 — In recognition of their extraordinary contributions to IPC and the electronic interconnect industry...
BANNOCKBURN, Ill., USA, February 19, 2013 — IPC — Association Connecting Electronics Industries ® announces the appointment of John Hasselmann...
BANNOCKBURN, Ill., USA, February 20, 2013 — IPC — Association Connecting Electronics Industries ® presented Committee Leadership, Distinguishe...
BANNOCKBURN, Ill., USA, February 26, 2013 — IPC — Association Connecting Electronics Industries ® bestowed its highest corporate honors to Loc...
BANNOCKBURN, Ill., USA, February 27, 2013 — IPC — Association Connecting Electronics Industries ® announces the appointment of Peter Chiang as ...
BANNOCKBURN, Ill., USA, March 4, 2013 — In recognition of their significant contributions of time and talent and ongoing leadership in IPC and ...
BANNOCKBURN, Ill., USA, March 5, 2013 — IPC — Association Connecting Electronics Industries ® announced today the January findings from its mon...
BANNOCKBURN, Ill., USA, March 6, 2013 — IPC — The first IPC World Championship hand soldering competition at IPC APEX EXPO ® on February 21 li...
BANNOCKBURN, Ill., USA, March 7, 2013 — The need to look at the big picture or the whole electronic system rather than focusing on its individu...
BANNOCKBURN, Ill., USA, March 8, 2013 — From insights into revolutionary advancements that the electronics manufacturing industry will help dri...
BANNOCKBURN, Ill., USA, March 12, 2013 — The North American PCB Market Report , published this week by IPC – Association Connecting Electroni...
BANNOCKBURN, Ill., USA, March 13, 2013 — IPC — Association Connecting Electronics Industries ® announces the release of a new study, IPC Execut...
BANNOCKBURN, Ill., USA, March 19, 2013 — Over the last few years, rival packaging technologies system-on-chip (SoC) and system-in-package (SiP)...
BANNOCKBURN, Ill., USA, March 26, 2013 — The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks ...
BANNOCKBURN, Ill., USA, March 27, 2013 — More than 60 technical papers addressing critical issues in specialized design, packaging, assembly a...
BANNOCKBURN, Ill., USA, March 28, 2013 — IPC — Association Connecting Electronics Industries ® has opened registration for the IPC/FED Conferen...
BANNOCKBURN, Ill., USA, March 28, 2013 — IPC — Association Connecting Electronics Industries ® announced today the February findings from its mo...
BANNOCKBURN, Ill., USA, March 29, 2013 — In response to members’ needs for support in global supply chain verification, IPC — Association Connec...
BANNOCKBURN, Ill., USA, April 3, 2013 — IPC — Association Connecting Electronics Industries ® invites researchers, academics, technical expert...
BANNOCKBURN, Ill., USA, April 4, 2013 — While North American manufacturing begins another slow recovery and leading indicators point to modest...
BANNOCKBURN, Ill., USA, April 10, 2013 — IPC — Association Connecting Electronics Industries ® announced the French language release of IPC-77...
BANNOCKBURN, Ill., USA, April 16, 2013 — Staying informed of regulations impacting the electronics industry is a daunting task. To help electro...
BANNOCKBURN, Ill., USA, April 17, 2013 — IPC ESTC will feature eight professional development courses examining packaging, materials, design a...
BANNOCKBURN, Ill., USA, April 19, 2013 — To help combat the growing threat of intellectual property theft and counterfeiting, IPC — Associatio...
BANNOCKBURN, Ill., USA, April 22, 2013 — IPC — Association Connecting Electronics Industries ® invites researchers, academics, technical expe...
BANNOCKBURN, Ill., USA, April 23, 2013 — IPC members will have an opportunity to join their fellow manufacturers on Capitol Hill to educate po...
Ok, but exactly what is 'desktop manufacturing'?. Well, it's like industrial manufacturing – but on a smaller, really smaller scale – with for a examp...
BANNOCKBURN, Ill., USA, April 25, 2013 — Although mobile electronics dominate the consumer electronics market, Zane A. Ball, Vice President, Int...
BANNOCKBURN, Ill., USA, April 29, 2013 — IPC — Association Connecting Electronics Industries ® announces the release of a new DVD containing t...
BANNOCKBURN, Ill., USA, April 30, 2013 — IPC — Association Connecting Electronics Industries ® announced today the March findings from its month...
BANNOCKBURN, Ill., USA, April 30, 2013 — If a picture is worth a thousand words, the H revision of IPC-A-600, Acceptability of Printed Boards ...
BANNOCKBURN, Ill., USA, May 6, 2013 — Considered a niche technology in the recent past, embedded component technology is rapidly gaining ground...
BANNOCKBURN, Ill., USA, May 7, 2013 — Electronic medical device manufacturers are under constant pressure to deliver innovative products on ti...
BANNOCKBURN, Ill., USA, May 8, 2013 — IPC — Association Connecting Electronics Industries ® announces that IPC APEX EXPO ® 2012 has been recog...
Average pricing for Chinese-manufactured photovoltaic (PV) solar modules could surge by 45 percent in June, cutting some solar project IRRs to below 7...
A £236,000 grant from the European Regional Development Fund (ERDF) will help create some 22 sustainable, new, hi-tech jobs at Sub10 Systems - a speci...
ON Semiconductor continues to expand its portfolio of high performance IGBTs targeted at high performance power conversion (HPPC) consumer appliance a...
In total, the top 20 semiconductor companies’ sales increased by 2% in 1Q13 as compared to 1Q12, one point better than the total 1Q13/1Q12 worldwide s...
Vicor Corporation expanded its ultra high density Picor Cool-Power PI31xx series of isolated, ZVS-based DC-DC converters....
Hitachi Kokusai Electric Inc. (“HiKE”) has completed a collaboration with u-blox to develop a custom M2M wireless module solution targeted at industri...
Defence and security company Saab’s subsidiary MEDAV GmbH has received an order for the electromagnetic signal-sensor part of the Brazilian border sec...
Rutronik Elektronische Bauelemente GmbH officially joins China Electronics Distributor Alliance (CEDA) after approval by the CEDA executive board memb...
Top executives from company now in administration form startup to develop next-generation haptic and embedded audio technology.View the full article H...
Handset sales were down year-over-year in all regions expect Asia-Pacific, according to Gartner. View the full article HERE....
Mentor Graphics discusses the development of smart grid connected embedded devices that comply with the Smart Energy Profile standard from the ZigBee ...
Texas Instruments upgrades micromirror development tool for higher brigtness, higher resolution embedded applications, including measurement for 3-D p...
The launch of Discovering Start-Ups 2013 marks the start of this year’s search for the most innovative wireless technologies and entrepreneurs from ac...
Altera Corporation announces that it has signed a definitive merger agreement to acquire Enpirion, a provider of high-efficiency, integrated power con...
TowerJazz, announces a collaboration with TLi (Technology Leaders & Innovators), a fabless company that designs non-memory integrated circuits (IC...
Europe’s anti-dumping and countervailing investigation on China suggested that the government has subsidized their domestic solar manufacturers, and E...
Teledyne Technologies announces that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V., a fabless semiconductor company that develops hi...
BIO-key International, a provider of fingerprint biometric identification solutions, reports that the company has executed an OEM agreement with Carad...
ERNI has opened new sales offices in Chengdu and Nanjing, in order to "further expand the operations in China"....
Shipments and revenue of video surveillance equipment in Russia and Eastern Europe are on track to approximately double from 2012 to 2017, buoyed by i...
After peaking in Q4 2012, smartphone and tablet demand decreased in Q1 of 2013. However, as NAND flash suppliers continually adjusted supply levels to...
Spurred by safety mandates, combo inertial sensor sales for automotive expected to grow 77 percent in 2013, according to IHS. View the full article HE...
Japan's chip vendors in the top 20 ranked by sales in Q1 all suffered declining sales compared with 1Q13 and were four of the worst five performing in...
GreenTouch consortium claims the energy consumed by networks in 2020 could be reduced to 10 percent of 2010 levels while supporting large increase in ...
Norwegian fabless chip company adds microcontroller family based on the full Cortex-M4 core including floating-point unit and SIMD instructionsView th...
The top eight vendors saw falling revenue in the industrial semiconductor market in 2012, according to market researcher IHS. View the full article ...
Leading foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. has seen its sales in 2013 running at 25 percent higher than in 2012 with the p...
Startup multicore debug tool developer reveals PMC-Sierra as lead partner for a heterogeneous debug and development system.View the full article HERE....
Specialty foundry executives are upbeat as they report a record number of tape outs of ICs in the first quarter of 2013 View the full article HERE......
The red hot market for acceleration and yaw sensors cooled in 2012, growing only 7 percent, according to market research firm IC Insights. View the fu...
Qualcomm maintains lead in fast-growing smartphone application processor market with 43 percent in 2012. View the full article HERE....
Europe's leading chipmaker has signed a deal to license Wi-Fi technology from 2006 startup Quantenna for integration in a variety of system chips aime...
Following the unexpected death of Jerald Fishman, CEO of Analog Devices Inc., the company has announced Vincent Roche as CEO, effective immediately.Vi...
Entry-level supercomputer starting at $500,000 aims at high-end engineering, computational modeling and simulation work.View the full article HERE.......
EDA software vendor has started the process of buying a Polish company as it builds up its portfolio of IP cores.View the full article HERE....
Firm plans to incorporate the novel file-system level compression technology it acquired from Altior into future Panther security chips. View the full...
Synopsys and Imagination made gains on leader ARM in the semiconductor IP market in 2012, according to market research firm Gartner.View the full arti...
Intel will include improved graphics processing technology called Iris in some of its Haswell processors.View the full article HERE....
For NXP selling microcontrollers is not just about the microcontroller – or the tools. It has bought ARM specialist development tools vendor Code Red ...
In this Telecom Council Mobile Forum M2M Workshop keynote address, the death of M2M as it currently exists is predicted, much like the death of non-st...
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